Taesung Supplies Glass Substrate TGV Equipment to Korea Ceramic Technology Institute

Taesung has supplied next-generation semiconductor packaging glass substrate TGV etching equipment to the Korea Ceramic Technology Institute. The supplied equipment precisely etches glass substrates processed by lasers to create the shape and size of through holes. The TGV (Through Glass Via) technology forms fine holes that penetrate the glass substrate and creates metal wiring inside to connect circuits on both sides of the substrate. This process is utilized for the high integration of AI and high-performance computing (HPC) semiconductors. Taesung is expanding its technology accumulated from its existing PCB manufacturing equipment business into the glass substrate field and possesses equipment technology that corresponds to key processes such as TGV etching, alkaline etching, etching, cleaning, and plating. A mass production system has also been established centered around the new factory in Cheonan, and it is necessary to meet customer demands. With the expansion of the AI semiconductor and high-performance server markets, the importance of advanced packaging technology is increasing. However, this supply does not have a direct impact on the virtual asset market or the supply of mining hardware. A representative from Taesung stated that they plan to accelerate mass production applications with domestic and international customers starting from this supply.

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